Itenest Makes Its Debut at DesignCon 2026

SANTA CLARA, Calif. — DesignCon 2026, the world's premier event for high-speed electronic design, successfully concluded from February 24 to 26 in Santa Clara, California. At the event, Itenest partnered with Foxconn Interconnect Technology (FIT) to deliver a live demonstration of an advanced 224G high-speed cable testing solution.

In addition to the joint demonstration, Itenest showcased its core solutions, including high-frequency Vector Network Analyzer (67 GHz) and the 67GHz matrix switch. Backed by formidable technical expertise, Itenest drew significant attention from leading global companies, further consolidating its position at the forefront of the high-speed testing industry.

• Industry Hotspots: Focusing on 448G, CPC Packaging, and PCIe 7.0

This year's event centered on single-channel 448G, CPC packaging, and PCIe 7.0 as core hotspots, attracting participation from across the entire industry, including chips, systems, high-speed interconnects, PCB materials, and testing solutions. Focusing on the testing demands of next-generation high-speed interconnects;

Itenest is advancing the technological evolution from 112G to 224G and 448G in sync with the industry, providing end-to-end testing solutions for high-speed transmission in AI computing data centers.

• Standout Technical Highlights: Matrix Switches and Calibration Algorithms Attract Top-Tier Customers

During the exhibition, the Itenest booth saw surging popularity. Executives and core engineers from world-renowned companies—including NVIDIA, Google, Microsoft, AMD, Intel, SpaceX, Marvell, Amphenol, FIT, TE Connectivity, Molex, and Luxshare—visited for in-depth exchanges. They focused primarily on three major technical highlights:

• High-Speed Cable Testing Solutions (VNA + Matrix Switch + Software)

As high-speed cables of data center rapidly evolve to support higher speeds, massive data volumes, and high-density cable configurations, Itenest's high-speed testing solutions stand out for their high integration and efficiency. Notably, the MSW67 utilizes a streamlined architecture to achieve efficient multi-channel switching, significantly elevating test automation. By improving efficiency while helping customers balance cost control, the complete solution attracted the attention of numerous prospective clients.

• High-Precision De-embedding and Multi-Port Calibration Algorithms

High-speed interconnect customers and industry experts highly praised the precision of Itenest's de-embedding algorithms and fast calibration capabilities. Itenest consistently adheres to independent R&D and the continuous refinement of its core intellectual property, which serves as a strong testament to the differentiated competitiveness of the company's products.

• 110GHz Vector Network Analyzer for Next Generation High-Speed Cable

The 67GHz VNA showcased at the event demonstrated outstanding performance, earning widespread industry recognition. Meanwhile, the company's 110GHz VNA drew extensive attention. It is fully capable of meeting the R&D and production needs for 224G and future 448G high-speed cables, laying a solid technological foundation for subsequent product iterations and market expansion.

• Future Outlook

Taking DesignCon 2026 as a new starting point, Itenest is committed to continuous investment in the R&D of high-speed interconnect testing technologies, further deepening collaborations with top-tier global customers. The company aims to provide highly competitive, high-frequency, and high-speed automated testing solutions for AI data centers, high-speed interconnects, semiconductors, and server industries, ultimately accelerating the global reach of China's high-end testing instruments.

Moving forward, Itenest will maintain an active presence at premier international exhibitions and conferences. By driving industry upgrades through technological innovation, Itenest looks forward to building a high-speed interconnected future alongside its global partners.